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RiseLink Redefines Edge AI with the BK7259 "Powerhouse" and R2 Unified AI Developer Platform at Embedded World 2026

prnewswire.com
TUYA The article mentions Tuya Smart's long-term collaboration with RiseLink Technologies to support scalable intelligent device infrastructure. The companies are jointly showcasing products at Embedded World 2026. The sentiment is neutral as it focuses on a partnership and product showcase without indicating a direct impact on Tuya's stock performance.

RiseLink Redefines Edge AI with the BK7259 "Powerhouse" and R2 Unified AI Developer Platform at Embedded World 2026 NUREMBERG, Germany, March 11, 2026 /PRNewswire/ -- RiseLink Technologies, a global leader in low-power connectivity with a 20-year legacy in semiconductor innovation, today announced the launch of its BK7259 Edge AI powerhouse at Embedded World 2026. As the centerpiece of the new R2 Unified AI Developer Platform, the BK7259 is designed to move intelligence from the cloud directly onto hardware, enabling a new generation of autonomous, secure, and reliable smart terminals.

The BK7259: An Edge AI Powerhouse

The BK7259 is a highly integrated cognitive hub built on a single die, replacing the inefficient multi-chip hardware stacks of the past. By combining high-definition video, advanced audio, precise motor control, and dedicated AI processing in one platform, RiseLink provides the "body and nervous system" of intelligent devices so developers can focus on building the unique "soul" of their products.

Key features include:

The R2 Unified AI Developer Platform

Alongside the BK7259, RiseLink is debuting the R2 Unified AI Developer Platform, designed to reduce friction and accelerate intelligent product development.

Platform highlights include:

Vision and Leadership at Embedded World 2026

RiseLink's presence at Embedded World 2026 is further highlighted by leadership engagements at the event:

Strategic Showcase with Tuya Smart

RiseLink continues its long-term collaboration with Tuya Smart (NYSE: TUYA; HKEX: 2391) to support scalable intelligent device infrastructure. At Embedded World 2026, the companies are jointly showcasing:

Visit RiseLink at Embedded World 2026

Location: Hall 3, Booth 3-656

Experience: Live demonstrations of the BK7259 Edge AI powerhouse and the R2 Unified AI Developer Platform

About RiseLink Technologies

RiseLink is a chip design company shipping over 300 million chips annually. Its technology powers products for global brands including Samsung, LG, Haier, and Midea.

About Tuya Smart

Tuya Smart is a global AI cloud platform service provider that enables businesses to rapidly build smart commercial solutions across energy, real estate, and other industries.

SOURCE Riselink