Form 8-K
8-K — APPLIED MATERIALS INC /DE
Accession: 0001628280-26-067303
Filed: 2026-10-26
Period: 2026-10-26
CIK: 0000006951
SIC: 3674 (SEMICONDUCTORS & RELATED DEVICES)
Item: Other Events
Item: Financial Statements and Exhibits
Documents
8-K — amat-20261026.htm (Primary)
EX-99.1 (ex991prforprojectbasil.htm)
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8-K
8-K (Primary)
Filename: amat-20261026.htm · Sequence: 1
amat-20261026
0000006951FALSEAPPLIED MATERIALS INC /DE00000069512026-10-262026-10-26
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
____________________________________________________________________
FORM 8-K
____________________________________________________________________
CURRENT REPORT
Pursuant to Section 13 or 15(d) of the Securities Exchange Act of 1934
Date of Report (Date of earliest event reported): October 26, 2026
____________________________________________________________________
Applied Materials, Inc.
(Exact name of registrant as specified in its charter)
____________________________________________________________________
Delaware 000-06920 94-1655526
(State or other jurisdiction of incorporation) (Commission File Number) (IRS Employer Identification No.)
3050 Bowers Avenue
P.O. Box 58039
Santa Clara, CA 95052-8039
(Address of principal executive offices)
Registrant’s telephone number, including area code: (408) 727-5555
N/A
(Former name or former address, if changed since last report.)
Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions:
☐ Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425)
☐ Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12)
☐ Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b))
☐ Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c))
Securities registered pursuant to Section 12(b) of the Act:
Title of Each Class Trading Symbol Name of Each Exchange on Which Registered
Common Stock, par value $.01 per share AMAT The NASDAQ Stock Market LLC
Indicate by check mark whether the registrant is an emerging growth company as defined in Rule 405 of the Securities Act of 1933 (§230.405 of this chapter) or Rule 12b-2 of the Securities Exchange Act of 1934 (§240.12b-2 of this chapter).
Emerging Growth Company ☐
If an emerging growth company, indicate by check mark if the registrant has elected not to use the extended transition period for complying with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act). ☐
Item 8.01 Other Events.
On October 26, 2026, Applied Materials, Inc. (“Applied”) entered into an accelerated share purchase agreement (the “Agreement”) to acquire shares of common stock of BE Semiconductor Industries N.V. (“Besi”), a Dutch public limited company. When combined with Applied’s existing ownership of Besi shares, Applied would own approximately 20% of the outstanding shares of the common stock of Besi following the purchase under the Agreement. The delivery of Besi shares pursuant to the Agreement is subject to the expiration or termination of the applicable waiting period under the Hart-Scott-Rodino Antitrust Improvements Act of 1976, as amended (the “HSR Act”).
Applied issued a press release regarding the purchase of Besi shares, a copy which is furnished as Exhibit 99.1 to this Current Report on Form 8-K.
Item 9.01 Financial Statements and Exhibits.
(d) Exhibits.
Exhibit No. Description
99.1
Press Release issued by Applied Materials, Inc., dated October 26, 2026
104 Cover Page Interactive Data File (formatted as inline XBRL)
Forward Looking Statements
This report contains forward-looking statements regarding the purchase of Besi shares by Applied. These statements and their underlying assumptions are subject to risks and uncertainties. Factors that could cause actual results to differ materially from those expressed or implied by such statements include the expiration or termination of the applicable waiting period under the HSR Act and the risks and uncertainties described in our filings with the Securities and Exchange Commission, including our most recent Forms 10-K, 10-Q and 8-K. All forward-looking statements are based on management’s current estimates, projections and assumptions, and we assume no obligation to update them.
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized.
Applied Materials, Inc.
(Registrant)
Date: October 26, 2026 By: /s/ Teri A. Little
Teri A. Little
Senior Vice President, Chief Legal Officer
and Corporate Secretary
EX-99.1
EX-99.1
Filename: ex991prforprojectbasil.htm · Sequence: 2
Document
Exhibit 99.1
Applied Materials to Increase its Strategic Investment in BE Semiconductor Industries
Applied enters into agreement to increase its investment to approximately 20 percent of outstanding shares, reinforcing the companies’ long-term strategic partnership in advanced packaging
SANTA CLARA, Calif., Oct. 26, 2026 – Applied Materials, Inc. (Nasdaq: AMAT) today announced it is increasing its investment in BE Semiconductor Industries N.V. (Besi) (Euronext Amsterdam: BESI), a leading manufacturer of assembly equipment for the semiconductor industry, to approximately 20 percent of Besi’s outstanding shares. The share purchase would add to Applied Materials’ current investment in Besi, which Applied initially made in April 2025.
The companies have a longstanding strategic collaboration, which began in 2020 and was recently expanded with Besi joining Applied Materials’ EPIC Center as an Innovation Partner. The expanded partnership extends the companies’ co-innovation beyond hybrid bonding into new interconnect architectures and applications supporting the semiconductor industry’s AI-driven scaling roadmap. Areas of collaboration include next-generation 3D IC scaling, logic and memory integration, scaling of thermo-compression bonding and new die-on-wafer, die-on-die and die-on-panel integration platforms.
“Applied Materials is adding to its investment in Besi as hybrid bonding technology and next-generation interconnect architectures become increasingly critical enablers of energy-efficient AI compute performance,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “We also look forward to furthering our strategic collaboration with Besi and delivering the innovative products and technologies our customers need to scale AI systems.”
Applied Materials has entered into an accelerated share purchase agreement for the Besi shares, and the delivery of the shares is subject to the expiration or termination of the applicable waiting period under the Hart-Scott-Rodino Antitrust Improvements Act of 1976, as amended (the HSR Act).
Applied Materials views its investment in Besi as long term. Applied currently has no intention to increase its investment in Besi beyond approximately 20 percent, and Applied does not intend to seek board representation at Besi.
Forward-Looking Statements
This press release contains forward-looking statements regarding the purchase of Besi shares by Applied Materials. These statements and their underlying assumptions are subject to risks and uncertainties. Factors that could cause actual results to differ materially from those expressed or implied by such statements include the expiration or termination of the applicable waiting period under the HSR Act and the risks and uncertainties described in our filings with the Securities and Exchange Commission, including our most recent Forms 10-K, 10-Q and 8-K. All forward-looking statements are based on management’s current estimates, projections and assumptions, and we assume no obligation to update them.
About Applied Materials
Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions that are at the foundation of virtually every new semiconductor and advanced display in the world. The technology we create is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied, we push the boundaries of science and engineering to deliver material innovation that changes the world. Learn more at www.appliedmaterials.com.
# # #
Contact:
Ricky Gradwohl (editorial/media) 408.235.4676
Mike Sullivan (financial community) 408.986.7977
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