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U.S. Semiconductor Industry Convenes at Glass4Chips Summit on May 14-15

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NVDA The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging, which could indirectly benefit companies like Nvidia involved in high-performance computing and AI, though Nvidia is not directly mentioned. AMD The article discusses advancements in semiconductor packaging using glass substrates, a development that could impact the broader semiconductor industry. While AMD is not directly mentioned, such innovations could influence future chip performance and manufacturing processes relevant to the company. INTC The article focuses on the U.S. semiconductor industry's exploration of glass substrates for chip packaging. This innovation could impact Intel's manufacturing and packaging strategies, though the company is not explicitly named in the text. QCOM The article highlights the U.S. semiconductor industry's push for advanced packaging solutions using glass substrates. This trend could be relevant to Qualcomm's mobile and AI chip development, although the company is not directly mentioned. MU The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. While Micron is not directly mentioned, advancements in packaging technology are crucial for memory solutions, potentially impacting the company's future products. AMAT The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. Applied Materials, a key supplier of manufacturing equipment, could be involved in enabling these new technologies, though not explicitly mentioned. LRCX The article discusses the U.S. semiconductor industry's exploration of glass substrates for advanced chip packaging. Lam Research, a major equipment supplier, could play a role in the manufacturing processes for these new materials, though it is not directly cited. KLAC The article discusses the U.S. semiconductor industry's move towards glass substrates for chip packaging. KLA Corporation, which provides process control and yield management solutions, could be involved in the validation and implementation of these new technologies, though not directly mentioned. MRVL The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. This innovation could impact Marvell's networking and custom silicon solutions, though the company is not directly mentioned. NXPI The article highlights the U.S. semiconductor industry's exploration of glass substrates for advanced chip packaging. This development could be relevant to NXP's automotive and industrial semiconductor applications, though the company is not directly mentioned. ON The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. ON Semiconductor, involved in automotive and industrial solutions, could benefit from advancements in chip performance and manufacturing enabled by this technology, though not directly mentioned. ADI The article discusses the U.S. semiconductor industry's exploration of glass substrates for advanced chip packaging. This innovation could impact Analog Devices' high-performance analog and mixed-signal integrated circuits, though the company is not directly mentioned. MCHP The article discusses the U.S. semiconductor industry's exploration of glass substrates for advanced chip packaging. This innovation could impact Microchip Technology's microcontroller and analog solutions, though the company is not directly mentioned. SWKS The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. This advancement could indirectly benefit Skyworks Solutions, a supplier of analog semiconductors, though the company is not directly mentioned. ALGN The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. While Align Technology is not directly mentioned, advancements in semiconductor technology are foundational to the digital dentistry solutions they provide. TER The article discusses the U.S. semiconductor industry's exploration of glass substrates for advanced chip packaging. Teradyne, a provider of testing equipment for semiconductors, could be involved in the validation of these new technologies, though not directly mentioned. ASML The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. While ASML is not directly mentioned, their lithography equipment is critical for semiconductor manufacturing, and future innovations like glass substrates could impact their technology roadmap. CDNS The article discusses the U.S. semiconductor industry's exploration of glass substrates for advanced chip packaging. Cadence, a provider of electronic design automation software, could be involved in the design of chips utilizing these new packaging technologies, though not directly mentioned. SNPS The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. Synopsys, a provider of electronic design automation tools, could be involved in the design of chips utilizing these new packaging technologies, though not directly mentioned. MTRX The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. While Matterport is not directly mentioned, advancements in semiconductor technology are foundational to the spatial data solutions they provide. GOOG The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging, relevant to AI and quantum systems. Google, a major player in AI, could be impacted by these advancements, though not directly mentioned. MSFT The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging, relevant to AI systems. Microsoft, a major AI player, could be impacted by these advancements, though not directly mentioned. AMZN The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging, relevant to AI systems. Amazon, a major AI player, could be impacted by these advancements, though not directly mentioned. META The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging, relevant to AI systems. Meta, a major AI player, could be impacted by these advancements, though not directly mentioned. TSLA The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging, relevant to AI systems. Tesla, which relies heavily on advanced semiconductors for its AI-driven vehicles, could be impacted by these advancements, though not directly mentioned. QRVO The article discusses the U.S. semiconductor industry's exploration of glass substrates for advanced chip packaging, relevant to 6G systems. Qorvo, a provider of RF solutions, could be impacted by these advancements, though not directly mentioned. NOK The article mentions Nokia Bell Labs as a panel participant, indicating their involvement in discussions around advanced semiconductor packaging and 6G systems. This suggests a neutral to slightly positive interest in the technological advancements discussed. SAM The article mentions Samtec Inc. as a panel participant, indicating their involvement in discussions around advanced semiconductor packaging. This suggests a neutral interest in the technological advancements discussed. MRAM Mosaic Microsystems is mentioned as a panel participant, and the article highlights their work with glass-wafer supply chains and the manufacturability of glass-based devices. This indicates strong positive sentiment towards their role in advancing glass substrate technology. UMC The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. UMC, as a foundry, could be involved in manufacturing these new technologies, though not directly mentioned. TSM The article discusses the U.S. semiconductor industry's focus on glass substrates for next-generation chip packaging. While TSM is not directly mentioned, as the world's largest contract chip manufacturer, any significant shift in packaging technology could impact their operations and future strategies.

U.S. Semiconductor Industry Convenes at Glass4Chips Summit on May 14-15 Gathering in Albany, New York, one of the nation’s rising semiconductor innovation hubs, industry leaders will explore glass substrates as a next-generation material in chips packaging

Hosted by FuzeHub in collaboration with NY Creates, SEMI and IEEE Electronics Packaging Society, the summit’s registration is now open at fuzehub.com/glass4chips-summit

ALBANY, N.Y., April 30, 2026 (GLOBE NEWSWIRE) -- The 2026 Glass4Chips Summit will bring together leaders and innovators across industry, academia and government to address a framework for accelerating the adoption of glass substrates in next-generation semiconductor manufacturing and packaging. The series of strategic conversations that will unfold at the summit will plot critical next steps in strengthening U.S. leadership in the development of ever-higher-performing semiconductors that can meet the needs of AI, 6G and quantum systems.

Convening May 14-15 in Albany, New York, the Glass4Chips Summit will focus on practical ideas and urgent actions to address potential barriers to glass innovation and adoption, strengthen the glass supply chain and improve industry confidence and market readiness. Organized by FuzeHub with collaborators NY Creates, SEMI and IEEE Electronics Packaging Society, this two-day summit is designed to unite stakeholders across the semiconductor value chain to collaborate, build partnerships and drive progress in U.S.-based substrate manufacturing and advanced packaging.

“Glass-based technologies represent a significant opportunity to advance semiconductor performance and strengthen domestic manufacturing capabilities,” said Elena Garuc, Executive Director of FuzeHub, an industry-focused nonprofit that helps manufacturing and tech companies increase competitiveness, solve problems and speed growth. “The Glass4Chips Summit is designed to bring together the right partners across industries to move beyond discussion and toward actionable solutions that will accelerate adoption and support long-term industry growth.”

Summit participants—including semiconductor manufacturers, startups, advanced materials innovators, academic researchers, economic developers, policymakers and more—will engage in keynote discussions, panel sessions and working groups designed to drive actionable outcomes. Topics will include supply chain coordination, validation and testing requirements, collaborative ecosystem-building and strategies to accelerate commercialization of glass-based technologies.

The Summit’s keynote speakers are Bilal Hachemi, Ph.D., Senior Market and Technology Analyst at Yole Group, and Madhavan Swaminathan, Department Head, Electrical Engineering and Director, CHIMES at Penn State University. Hachemi closely monitors the semiconductor industry’s rapidly emerging packaging technologies (including the role of glass) and reports on these trends to provide a strategic global market analysis. Swaminathan is widely recognized for his pioneering work in glass substrates and packaging for high-frequency applications, including millimeter-wave (mm-wave) and emerging 6G systems. He brings more than three decades of experience in the field, including over a decade focused on 3D systems integration with glass.

Panel discussions at the Glass4Chips Summit will feature leaders from Nokia Bell Labs, Samtec Inc., DAI Nippon Printing Co., Mosaic Microsystems, Menlo Micro, ED2 Corp., Griffiss Institute, DMR Group, GO-SEMI, University of Binghamton, University of Albany, and Cornell University.

“NY Creates is proud to support the Glass4Chips Summit as part of our ongoing commitment to advancing semiconductor innovation and manufacturing both here in Albany and across New York State,” said Dave Anderson, NY Creates President & CEO. “By convening leaders from public, private, and non-profit sectors, this event will drive expanded collaborative opportunities while highlighting the role of glass packaging in bridging lab-to-fab challenges, supporting the semiconductor ecosystem across New York State and the U.S.”

“Menlo has built a glass-wafer supply chain and demonstrated both the manufacturability and reliability of glass-based devices,” said Chris Keimel, CTO of Menlo Micro. The opportunity now is scaling these capabilities to mature the supply chain to enable glass solutions at the microsystem level. The Glass4Chips Summit is an important step in bringing the ecosystem together to align on those challenges, share progress, and accelerate the path to adoption.

Governor’s Office of Semiconductor Expansion, Management and Integration (GO-SEMI) Executive Director Merideth Andreucci said, “Under the leadership of Governor Hochul, New York has become the domestic epicenter for semiconductor investment - in part by leveraging our unique history of innovation in computing and glass technologies. GO-SEMI recognizes the immense potential of this technology and remains committed to collaborating with partners like FuzeHub and NY Creates to ensure the sustained growth of the State's semiconductor industry and its supply chain.”

Registration for the 2026 Glass4Chips Summit is now open. For more information and to register, visit fuzehub.com/glass4chips-summit.

About FuzeHub

FuzeHub is a nonprofit organization that connects New York’s small and mid-sized manufacturing companies to the resources, programs and expertise they need for technology commercialization, innovation and business growth. Through its custom assessment, matching, and referral platform, FuzeHub helps companies navigate New York’s robust network of industry experts at Manufacturing Extension Partnership (MEP) centers, universities, economic development organizations, and other providers. FuzeHub is the statewide New York MEP center, supported by Empire State Development’s Division of Science, Technology & Innovation. For more information on FuzeHub, visit www.fuzehub.com.

About NY Creates

NY Creates serves as a lab-to-fab bridge for advanced electronics, fostering public-private and industry-academic partnerships for technology development and innovation. NY Creates attracts and leads industry-connected innovation and commercialization projects that secure significant investment, advance R&D in emerging technologies, and generate the jobs of tomorrow. NY Creates runs some of the most advanced facilities in the world, boasts more than 2,700 industry experts and faculty, and manages public and private investments of $25 billion—placing it at the global epicenter of high-tech innovation and commercialization. Learn more at www.ny-creates.org.

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